Multilayer composite backed card

ABSTRACT

A transaction card is disclosed. The transaction card may include a first card component of non-plastic card material having a thickness of no more than about 0.3 mm, a second card component of composite fiber material having a thickness of no more than about 0.3 mm, and an adhesive for affixing the first layer and second layer together. The non-plastic card material may be selected from a group including wood, bamboo, steel, copper, aluminum, silver, gold, platinum, granite, marble, and slate and the composite fiber material may include at least one of a glass fiber composite, a carbon fiber composite, or a natural fiber composite.

PRIORITY CLAIM

This disclosure claims a right of priority under 35 U.S.C. § 119 to U.S.provisional patent application No. 62/241,421, filed on Oct. 14, 2015.The aforementioned application is incorporated herein by reference inits entirety.

TECHNICAL FIELD

The disclosed embodiments generally relate to transaction cardconstructions, and particularly, to a multilayer card constructionimplementing non-traditional card materials.

BACKGROUND

The term “transaction card,” as used herein, refers to any physical cardproduct that is configured to provide information, such as financialinformation (e.g., card numbers, account numbers, etc.), quasi-financialinformation (e.g., rewards balance, discount information, etc.), and/orindividual-identifying information (e.g., name, address, etc.), when thecard is read by a card reader. Examples of transaction cards includecredit cards, debit cards, gift cards, rewards cards, frequent flyercards, merchant-specific cards, discount cards, etc., but are notlimited thereto. The term “transaction card” may include anidentification card such as a passport card, a driver's license, anentry point access card, or the like.

Transaction cards, such as credit and debit cards, prepaid cards, giftcards, etc., are typical means for customers to complete financialtransactions. Typically, transaction cards are cast out of a plasticpolymer material such as polyvinyl chloride (PVC), polycarbonate (PC),acrylonitrile butadiene styrene (ABS), or a combination of thesematerials. Typical credit cards may be manufactured from PVC extrudedsheets that are die-cut and may include other additional overlay orprint layers. The typical plastic card and its print (or overlay) layersmay be modified to add functional and/or visual features. For example, amagnetic strip may be affixed to one side, electronic components may beimplanted, the card may be stamped with the card number and customername, and color or a design may be added for appearance.

Some card issuers have also begun to manufacture niche transaction cardsfor brand differentiation and/or to imbue their customers with cachet orprovide a unique experience. These niche cards have been constructedwith a look and feel of metal by implementing one or more metallic corelayers such as a stainless steel or aluminum layer. The metallic corelayer typically is provided with a thickness to serve as a supportlayer, providing rigidity or structural integrity to the transactioncard. The introduction of metal as a support layer into a transactioncard, however, introduces a number of practical problems. For example,the use of a core metal layer as a support layer in a transaction cardmay prevent the card from meeting known card standards definingflexibility and deformation or other requirements. These cards may thusbe unsuitable for use with certain types of automated card readers, forexample. Also, because of the prohibitive cost associated with makingcards composed primarily of metal, these cards have remained niche cardsavailable only to a limited number of users.

It is desirable to implement metals and other non-traditional cardmaterials as a distinguishing feature of a transaction card withoutrelying on these non-traditional materials for structural support of thetransaction card. Existing manufacturing techniques, however, are notcapable of incorporating these materials in a non-support layer whilestill meeting certain transaction card standards. For example, manydesirable non-traditional materials, when constructed in a form factorof a transaction card as a non-support layer using traditionaltransaction card manufacturing techniques, are too brittle to meet therigidity or durability requirements of current transaction cardstandards.

The present disclosure is directed to a card construction implementingnon-traditional card materials that overcome one or more of the problemsset forth above and/or other problems associated with conventionaltransaction card constructions.

SUMMARY

The disclosed embodiments relate to a transaction card comprising a cardcomponent including a non-traditional (e.g., non-plastic) card material.The card component may be a non-support component for the transactioncard.

In one aspect, the present disclosure is directed to a transaction card.The transaction card may include a first card component of non-plasticmaterial having a thickness of no more than about 0.3 mm, a second cardcomponent of composite fiber material having a thickness of no more thanabout 0.3 mm, and an adhesive affixing the first card component andsecond card component together.

In one aspect, the present disclosure is directed to a method forconstructing a transaction card including steps of providing a firstcard component comprising non-plastic material and having a thickness ofno more than about 0.3 mm, providing a second card component comprisingcomposite fiber material and having a thickness of no more than about0.3 mm, and affixing the first second card components together using anadhesive.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments. In the drawings:

FIG. 1 is a cutaway illustration of an exemplary transaction card,consistent with disclosed embodiments;

FIG. 2 is a cross-sectional illustration of an exemplary transactioncard, consistent with disclosed embodiments;

FIG. 3A is a top-view illustration of an exemplary transaction card,consistent with disclosed embodiments;

FIG. 3B is a bottom-view illustration of the exemplary transaction cardof FIG. 3A;

FIG. 4 is an exploded-view illustration of an exemplary transactioncard, consistent with disclosed embodiments;

FIG. 5 is a top-view illustration of the exemplary transaction card ofFIG. 4;

and

FIG. 6 is a cross-sectional illustration taken along line 5-5 of FIG. 5,consistent with disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

The disclosed embodiments are directed to cards (e.g., transactioncards) including non-traditional card materials as a distinguishingfeature. For purposes of this disclosure, a “non-traditional cardmaterial” refers to a non-plastic material, that is, a material excludedfrom a category of materials including PVC, PC, ABS or other similarplastic or thermoplastic polymers. Examples of non-traditional cardmaterials that may be included in the disclosed cards (e.g., transactioncards) include, wood (e.g., ebony, pine, etc.), grass (e.g., bamboo),celluloid (e.g., with a tortoiseshell design), ceramics, stones (e.g.,marble, granite, slate, turquoise), metals (e.g., steel, copper,aluminum, silver, gold, platinum, etc.), paper, etc. Suchnon-traditional card materials are desirable to differentiate atransaction card from those made of the traditional plastics so as toevoke an emotion or imbue a user with a sentiment associated with theparticular chosen material. A transaction card of the disclosedembodiments may use any type of non-traditional card material or acombination of the non-traditional card materials that may provide thiseffect. Because a transaction card may be required to meet certainISO/IEC 7810 standards, including requirements for size, thickness, anddurability, the incorporation of non-traditional card materials in atransaction card requires use of other materials and manufacturingprocesses not used in traditional transaction card manufacturing.

For example, the ISO/IEC 7810 ID-1 standards for traditional bankingcards require a card of a particular thickness, e.g., about 0.76 mm, tomeet bending stiffness and durability and other geometric tolerancerequirements. A transaction card of the disclosed embodiments mayinclude a layer of a non-traditional card material that is a fraction ofthe maximum thickness of the transaction card. In some embodiments, anon-traditional card material layer may be constructed with a thicknessof about 0.3 mm. Many non-traditional card materials constructed as alayer at this thickness, however, are too brittle to be used intransaction cards.

FIG. 1 shows a transaction card 10 according to a disclosed embodiment.As shown in FIG. 1, transaction card 10 may include at least twocomponents, or layers. Thus, “transaction card 10” may be referred to as“multilayered transaction card 10”. Multilayered transaction card 10 mayinclude a first layer 12 including a non-traditional card material.First layer 12 may be a non-support layer. That is, first layer 12 isnot configured to provide significant structural integrity or support ofthe transaction card 10. And in some embodiments, the first layer isconfigured such it does not substantially contribute to the structuralintegrity of the card. Rather, the non-traditional card materialincluded in first layer 12 primarily provides a distinguishing featureor aesthetic of transaction card 10. Thus, the nature andcharacteristics of the non-traditional card material are a prominent,perceptible feature in a finished transaction card 10.

Multilayered transaction card 10 may also include a second layer 14,having a rigidity greater than first layer 12. Second layer 14 may bereferred to as a support layer or backer layer, and may include acomposite material, such as a composite fiber material. “Composite fibermaterial” refers to a composite material that includes a combination offibers and plastic or epoxy resin. Examples of composite fiber materialsinclude a fiberglass composite, a glass fiber composite, a carbon fibercomposite, or a natural fiber composite. Examples of natural fibercomposites include composites that include one or more natural fibers,such as cellulose, hemicelluloses, pectin, and lignin. The compositefiber material may include primarily one type of fiber, or may include amixture of two or more types of fibers.

In some embodiments, second layer 14 provides the structural integrityor support of the transaction card 10. The composite fiber material maybe selected to provide desired rigidity and flexibility to meet certainISO/IEC 7810 standards. In some embodiments, second layer 14, which maybe a support layer, may include other materials, such as metal and/orpaper. Paper can be included in a support layer to provide a reducedthickness, but it may not be as robust as a support layer including acomposite fiber material. First layer 12 and second layer 14 may bebonded together to form transaction card 10 using any suitable adhesiveor other bonding techniques that may vary based on the nature of thenon-traditional card material included in the first layer 12 and thecomposite material included in the second layer 14.

FIG. 2 illustrates a cross sectional view of transaction card 10according to a disclosed embodiment. Transaction card 10 may includefirst layer 12 and second layer 14. Transaction card 10 may also includeone or more additional layers 16, 18, and 19, for example. Transactioncard 10 may comprise an adhesive, such as adhesive layer 16, for bondingtogether first layer 12 with second layer 14. Any suitable adhesive maybe used based on the non-traditional card material included in firstlayer 12. Some suitable adhesives may be of the pressure-sensitiveadhesive type or a hot melt type of glue. In some embodiments theadhesive may be transparent or semitransparent. Layers 18 and 19 may beoptional, and may each be a thin-film topcoat or overlay layer. Overlaylayers 18 and 19 may be transparent and may function to seal transactioncard 10 from environmental forces and may provide a scratch resistant orsmooth layer to transaction card 10. In some embodiments, overlay layers18 and 19 may function as a print layer or to enhance print adhesion toenable personalization options and other features to be applied totransaction card 10. Overlay layers 18 and 19 may be composed of anysuitable plastic type film or lacquer used in traditional cardmanufacturing. Overlay layers 18 and 19 may also provide a desiredsurface finish or particular aesthetic for transaction card 10.

In some embodiments, though it may vary, the entire thickness oftransaction card 10 is about 0.76 mm, in conformance with the applicableISO/IEC 7810 standards. To meet this standard, the thickness of firstlayer 12 may be within about 0.3 mm. Second layer 14 (which may be asupport layer) may also be within about 0.3 mm. The combined thicknessof adhesive layer 16 and overlay layers 18 and 19 may be within about0.16 mm. These dimensions impose challenges that are overcome throughthe selection of a composite material for second layer 14 that providessufficient strength and rigidity to enable the implementation of atleast one non-traditional card material in first layer 12 whilepreserving an aesthetic of the selected non-traditional card material.

In some embodiments, second layer 14 may include a composite fibermaterial that includes at least one of glass fiber, carbon fiber, nylonfiber, flax fiber, or other suitable synthetic or natural fibrousmaterials. Processing the composite fiber material may involve weavingthe fibers, impregnating with an epoxy resin, and compressing using avacuum or a tool under pressure. The type of fiber, length of fiber,density, and interlay of fibers selected for the composite fibermaterial of second layer 14 may vary depending on the characteristics ofthe non-traditional card material included in first layer 12. Forexample, when the non-traditional card material is translucent, orrelatively brittle, the composite fiber material may be selected to betransparent or provide added structural integrity or support. In someembodiments, the composite fiber material is structured to meet certainISO/IEC 7810 standards when constructed in the transaction card 10 as awhole, considering the characteristics of the selected non-traditionalcard material.

In some embodiments, the composite fiber material is also structured tobe transparent or semitransparent such that the characteristics of thenon-traditional card material included in first layer 12 are perceptiblewhen viewed at a top and bottom surface of transaction card 10.

Transaction card 10 may be assembled using a lamination process applyingpressure and/or heat to bond and seal layers 12, 14, 16, 18, and 19together. These layers may be bonded in one or more steps using anytechnique that is suitable for the non-traditional card material and theadhesive applied. The lamination process may also be dictated based ondifferent personalization options and other features to be added totransaction card 10 such as a magnetic strip, name, logo or otherfeatures. In some embodiments, a print layer or other personalizationlayer may be provided on one or more of the top and bottom surfaces offirst layer 12 and second layer 14. Following lamination, transactioncard 10 may be cut to a desired shape. In some embodiments, lasercutting may be used.

FIG. 3A illustrates a top-view of transaction card 10 and FIG. 3Billustrates a bottom-view of transaction card 10. As shown in FIGS. 3Aand 3B, transaction card 10 may include a planar first exterior surface11 and a planar second exterior surface 13. First exterior surface 11may be covered by overlay 18 and second exterior surface 13 may becovered by overlay layer 19. Exterior surfaces 11 and 13 may be similarin size to that of conventional transaction cards. Transaction card 10may be configured to have any shape, such as the shape shown, or othershape selected for its ornamental or aesthetic design. On one or more ofexterior surfaces 11 and 13, additional features may be visible, such asidentifying information (e.g., card number, customer name, customersignature, expiration date, security code, etc.), additional informationstorage components (e.g., a microchip 48, a magnetic strip 24, barcodes, Quick Response (“OR”) codes, etc.), visual features (e.g.,colors, designs, pictures, logos, etc.), and the like. Some of thesevisible features may be provided or printed on external surface 11and/or 13, or on overlay layer 18 and/or 19. These features may also beprovided on or in first layer 12 or second layer 14 and visible throughat least one of transparent overlay layers 18 and 19.

Some materials included in first layer 12 may be translucent whenconstructed with a thickness of 0.3 mm. When the non-traditional cardmaterial is translucent, a reverse printing technique may be used suchthat a print layer is provided between second layer 14 and first layer12 and visible through exterior surface 11. Other techniques such asetching or engraving may also be used to provide personal information ontransaction card 10 where, for example, a hammered metal or a stone isused as the non-traditional card material. Additionally, the color of anadhesive for adhesive layer 16, as well as other properties of overlaylayers 18 and 19 may be selected to produce a desired aesthetic.

In some embodiments, transaction card 10 may be constructed with thepersonalization options and functionality to enable use and operationsimilar to other traditional transaction cards with the added experienceenabled by the use of a non-traditional card material.

FIG. 4. illustrates a two-piece transaction card 20 in accordance with adisclosed embodiment. For example, the disclosed embodiments include atwo-piece transaction card having two separate card components that maybe independent of each other and connectable to form the transactioncard. In an exemplary embodiment, transaction card 20 may include a cardframe 22. Card frame 22 may include at least two separate componentsthat are secured (e.g., attached, affixed, etc.) to each other to formtransaction card 20. For example, card frame 22 may include a first,upper card component 26 that forms a first surface of transaction card20 and a second, lower card component 28 that forms a second surface oftransaction card 20. Additional components may also be included.

Various methods may be used to manufacture the separate card componentswith different types of materials that are suitable for satisfyingcertain criteria or preferences. Consistent with the disclosedembodiments, upper card component 26 may be an aesthetic componentconstructed with at least a non-traditional card material, and lowercard component 28 may be a support component constructed with anexemplary composite fiber material. The non-traditional card materialsand composite fiber materials described above for transaction card 10may be used for transaction card 20. In addition, the construction ofthe separate components may allow for ease of assembly, as well ascustomization and the interchangeability of upper card component 26 madewith different non-traditional card materials. For example, users maycustomize the non-traditional transaction material to be used toconstruct the inlay portion (e.g., upper card component 26) of thetransaction cards, while a common lower card component 28 constructed ofa composite fiber material is used for each of the cards. In someembodiments, users may customize the composite fiber material used toconstruct lower card component 28 based on the selection of thenon-traditional card material for upper card component 26. In someembodiments, upper card component 26 may be constructed of a suitablecomposite fiber material, whereas the lower card component may beconstructed from a non-traditional card material.

In some embodiments, lower card component 28 may be made of atraditional plastic card material, such as PVC, PC, ABS or other similarplastic or thermoplastic polymers. The plastic material, together withan adhesive layer, may provide support for transaction card 20 when theinlay material (i.e., the non-traditional card material used in theinlay portion, such as upper card component 26) has a sufficientstrength.

Upper card component 26 and lower card component 28 may be manufacturedusing a process suitable for the selected materials. In an exemplaryembodiment, upper card component 26 may be manufactured using processessuch as milling, grinding, sanding, hammering, injection molding,compression molding, and the like, which may be suitable for a selectednon-traditional card material. Lower card component 28 may also bemanufactured using a process suitable for the selected composite fibermaterial. In an exemplary embodiment, lower card component 28 may beconstructed using suitable composite fiber material manufacturingprocesses, such as injection molding, compression molding, milling, etc.

In transaction card 20 shown in FIG. 4, upper card component 26 andlower card component 28 are separable and independent card components.For example, in one embodiment, lower card component 28 may form acavity 44 (shown in FIG. 4) and upper card component 26 may form aninlay component configured to be seated within cavity 44. In someembodiments, upper card component 26 may be pressed or inserted intocavity 44 formed in lower card component 28, and may be secured therein.Other suitable configurations can also be used. For example, transactioncard 20 may include a bucket-and-lid construction in which lower cardcomponent 28 forms a container and upper card component 26 forms a lidfor the container that rests on a rim of lower card component 28.

In an exemplary embodiment, upper card component 26 may include a topsurface 30 that defines a first side of transaction card 20. Top surface30 may form a first exterior surface 32 of transaction card 20. Inaddition, upper card component 26 may include a bottom surface 34 thatforms a first interior surface (bottom surface 34 is also referred to asfirst interior surface 34). Upper card component 26 may be a solidcomponent including a generally constant thickness. In otherembodiments, upper card component 26 may include other features, such asa beveled edge, support flange, hollow center, etc.

In an exemplary embodiment, lower card component 28 may include a baseportion 36 and a projecting wall 38. Base portion 36 may define a secondside of transaction card 20. For example, a bottom surface of baseportion 36 may form a second exterior surface 40 of transaction card 20.In addition, a top surface of base portion 36 may form a second interiorsurface 42. Projecting wall 38 may extend away from base portion 36 atthe circumference of base portion 36. The height of projecting wall 38defines at least a portion of the thickness of transaction card 20. Baseportion 36 and projecting wall 38 may together define a cavity 44 forreceiving upper card component 26.

Upper card component 26 and lower card component 28 may be securable toeach other to form transaction card 20. For example, upper cardcomponent 26 may be placed in (e.g., pressed into) cavity 44 such thatupper card component 26 forms an inlay component within a shell formedby lower card component 28. In some embodiments, upper card component 26may be pressed into cavity 44 and secured by projecting wall 38. In someembodiments, a space may be formed between upper card component 26 andlower card component 28, even after the two are joined to each other.This space may accommodate additional features, such as electroniccomponent 24. Upper card component 26 and lower card component 28 may bepermanently or temporarily secured to each other to form card frame 22.For example, upper card component 26 may be secured to lower cardcomponent 28 using an adhesive, overmolding, pressure fit, interferencefit, clasp, tongue-in-groove, post-and-hole, etc. Upper card component26 and lower card component 28 may be temporarily secured to each otherthrough an attachment feature (e.g., for hinged attachment, slidingattachment, etc.), which may allow card frame 22 to be disassembled.

Transaction card 20 may further include electronic component 24. As usedherein, an “electronic component” may be one or more devices and/orelements configured to receive, store, process, provide, transfer, send,delete, and/or generate information, such as data and/or signals. Forexample, electronic component 24 may be a microchip 48 (e.g., Europay,MasterCard, and Visa (“EMV”) chip), a communication device (e.g., nearfield communication (“NFC”) antenna, Bluetooth® device, WiFi device),etc. Electronic component 24 may be secured to card frame 22 in such away that allows card frame 22 to carry electronic component 24 whilemaintaining a utility of electronic component 24 (i.e., allowingelectronic component 24 to interact with a payment terminal or othertransaction card specific terminal). In some embodiments, electroniccomponent 24 may be sandwiched between upper card component 26 and lowercard component 28 within a space formed between upper card component 26and lower card component 28. For example, electronic component 24including an NFC antenna may be placed in cavity 44 before upper cardcomponent 26 is placed therein. In some embodiments, electroniccomponents 24 may be embedded in an adhesive material that is used tobond upper card component 26 to lower card component 28. In someembodiments, upper card component 26 may include an opening 46configured for receiving electronic component 24. For example, uppercard component 26 may include opening 46 for receiving an EMV chip 48.In this way, EMV chip 48 may be substantially flush with first exteriorsurface 32.

In some embodiments, EMV chip 48 may be located in a space between uppercard component 26 and lower card component 28 and a contact member maybe disposed in opening 46. For example, opening 46 may include aplurality of openings that each include a conductive member, eachconductive member being in contact with EMV chip 48 located in the spacebetween upper card component 26 and lower card component 28. Theconductive members create a plurality of contacts that are substantiallyflush with first exterior surface 32.

FIG. 5 illustrates a top view of transaction card 20 according to adisclosed embodiment. As shown in FIG. 5, upper card component 26functions as an inlay such that projecting wall 38 of lower cardcomponent 28 forms a perimeter of transaction card 20.

FIG. 6 illustrates a cross-sectional view of assembled transaction card20, taken along line 5-5 of FIG. 5. As shown, upper card component 26may be positioned in cavity 44 of lower card component 28. An adhesive,such as adhesive layer 50, may be placed between first interior surface34 and second interior surface 42 to adhere top wall 30 to bottom wall36. In this way, upper card component 26 may be secured (e.g., bonded)to lower card component 28 through adhesive layer 50. Adhesive layer 50may include any suitable adhesive material, such as a hot melt adhesive,pressure-sensitive adhesive, etc. Other means of attaching upper cardcomponent 26 to lower card component 28 may be used. For example, insome embodiments, upper card component 26 may be insert molded intolower card component 28. For example, lower card component 28 may beinjection molded around upper card component 26.

In some embodiments, electronic component 24 may be positioned betweenfirst interior surface 34 and second interior surface 42. For example,electronic component 24 (e.g., an NFC antenna, radio frequencycommunication device, etc.) may be embedded in adhesive layer 50. Inother embodiments, one or more electronic components 24 may bepositioned between adhesive layer 50 and at least one of first interiorsurface 34 and second interior surface 42 (e.g., with a second adhesivelayer interposed between the contacted surfaces). In other embodiments,one or more electronic components 24 may be embedded within upper cardcomponent 26 and/or lower card component 28. In the embodiment of FIG.4, EMV chip 48 may be secured to second interior surface 42 via adhesivelayer 50.

As shown in FIG. 6, a thickness of projecting wall 38 may define thethickness of transaction card 20. Cavity 44 formed by projecting wall 38may include a height that is the same as or slightly greater than thethickness of upper card component 26. In one exemplary embodiment, thethickness of transaction card 20 may be less than approximately 2 mm,which may be within a thickness range for transaction card 20 configuredfor contactless payments, for example. In another exemplary embodiment,the thickness of transaction card 20 may be less than approximately 1mm. For example, projecting wall 38 may define a thickness ofapproximately 0.76 mm. Transaction card 20 may include any othersuitable thickness. In some embodiments, projecting wall 38 may define arounded edge. Base portion 36 may include a thickness that isapproximately one half of the thickness of projecting wall 38. Forexample, base portion 36 may include a thickness in a range ofapproximately 0.3-0.4 mm.

With upper card component 26 positioned in cavity 44 of lower cardcomponent 28, a gap 52 may be formed around a perimeter thereof, betweena side wall of upper card component 26 and an inner side of projectingwall 38. Gap 52 may provide a space for expansion and/or contraction ofupper card component 26 and/or lower card component 28. Gap 52 may alsoallow for ease of removal of upper card component 26 from lower cardcomponent 28. In an exemplary embodiment, gap 52 may be approximately0.15 mm wide. In addition, the inner side of projecting wall 38 mayslope at an angle θ away from the side wall of upper card component 26.The slope of the inner side of projecting wall 38 may help guideinsertion of upper card component 26 into cavity 44. The angle θ may beapproximately 5 degrees, 10 degrees, 15 degrees, or any other suitableangle. Gap 52 may additionally or alternatively be an aesthetic elementof the ornamental design of transaction card 20.

Upper card component 26 may be positioned in cavity 44 such that firstexterior surface 32 is at or below a top surface 60 of projecting wall38. For example, upper card component 26 may be thinner than a depth ofcavity 44 such that upper card component 26 sits below flush by a space56. In an exemplary embodiment, upper card component 26 may include athickness of approximately 0.30 mm, such that space 56 is approximately0.05 mm high. In other embodiments, top surface 30 may be flush with atop of projecting wall 38 or top wall (or a portion thereof) may extendabove top surface 60 of projecting wall 38. In embodiments that includeadhesive layer 50, the total thickness of upper card component 26 andadhesive layer 50 may be approximately 0.30 mm. Additional overlaylayers, similar to overlay layers 18 and 19 shown in FIG. 2, may also beapplied to seal transaction card 20, providing a protective coating orother aesthetic finish, and to enable customization of personalizationoptions or other features.

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure.

The elements in the claims are to be interpreted broadly based on thelanguage employed in the claims and not limited to examples described inthe present specification or during the prosecution of the application,which examples are to be construed as non-exclusive. It is intended,therefore, that the specification and examples be considered as examplesonly, with a true scope and spirit being indicated by the followingclaims and their full scope of equivalents.

1.-14. (canceled)
 15. A method for constructing a transaction card,comprising: providing a first card component comprising non-plasticmaterial and having a thickness of about 0.3 mm; providing a second cardcomponent comprising composite fiber material and having a thickness ofabout 0.3 mm, the second card component having a rigidity greater thanthe first card component; and affixing the first and second cardcomponents together using an adhesive.
 16. The method of claim 15,wherein the non-plastic material is selected from a group consisting ofwood, bamboo, steel, copper, aluminum, silver, gold, platinum, granite,marble, or slate.
 17. The method of claim 15, wherein the compositefiber material comprises at least one material selected from a groupconsisting of glass fiber composite, carbon fiber composite, or naturalfiber composite.
 18. (canceled)
 19. The method of claim 15, wherein thetransaction card is a financial transaction card having a rigiditymeeting or exceeding existing ISO/IEC 7810 ID-1 standards for rigidity.20. The method of claim 15, wherein the transaction card has a totalthickness of about 0.76 mm.
 21. The method of claim 15, wherein thenon-plastic card material comprises celluloid configured in atortoiseshell pattern.
 22. The method of claim 15, further comprisinginserting the first card component into a cavity along a first surfaceof the second card component.
 23. The method of claim 22, wherein thesecond card component further comprises a projecting wall about aperimeter of the cavity.
 24. The method of claim 23, wherein theprojecting wall comprises a height comprising at least a portion of atotal thickness of the transaction card.
 25. The method of claim 23,wherein a gap is formed between the projecting wall and a perimeter ofthe first card component when the first and second card components areaffixed together.
 26. The method of claim 23, wherein the projectingwall comprises an inner surface forming the perimeter of the of thecavity, wherein the projecting wall slopes outward from the cavity. 27.The method of claim 23, wherein a first exterior surface of the firstcard component is even or below a top surface of the projecting wallwhen the first and second card components are affixed together.
 28. Themethod of claim 15, further comprising: providing an electroniccomponent associated with the transaction card; and placing theelectronic component between the first and second card components priorto affixing the first and second card components together.
 29. Themethod of claim 28, wherein the electronic component is placed within aspace formed between the first and second card components when the firstand second card components are affixed together.
 30. The method of claim28, wherein the electronic component is placed within an opening alongthe first card component when the first and second card components areaffixed together.
 31. The method of claim 30, wherein the electroniccomponent comprises a microchip that is substantially flush with a firstexterior surface of the first card component when the first and secondcard components are affixed together.
 32. The method of claim 15,further comprising: placing a first overlay layer over an exteriorsurface of the first card component; and placing a second overlay layerover an exterior surface of the second card component.
 33. The method ofclaim 32, wherein the first and second overlay layers are transparent orsemitransparent.
 34. The method of claim 32, wherein the first andsecond overlay layers further comprise print layers.
 35. The method ofclaim 32, wherein placing the first overlay layer further comprisesapplying a lacquer material to the exterior surface of the first cardcomponent, and wherein placing the second overlay layer furthercomprises applying the lacquer material to the exterior surface of thesecond card component.